Speculative Updated 2026-06-03
Pitch Deck Outline
The Energy Crisis: Global AI power consumption is on a trajectory to exceed 1,000 TWh by 2026.
The 6-slide pitch outline. The current recommended demonstrator path is documented in Alternative Materials and Methods — the pitch describes the long-range research vision.
- 01
The Thermodynamic & Environmental Wall
- · AI power: trajectory to >1,000 TWh by 2026
- · Water withdrawal: billions of m³ by 2027
- · Physical limit: Joule heating + embodied carbon
- · Motivation: bridge silicon-to-biological efficiency gap
- 02
The HELIOS-3D Hypothesis
- · Hybrid-manufactured Energy-Landscape Inference and Operation System
- · Carrier shift: charge → topologically protected 3D spin textures
- · Energy flip: investigate "spin caloritronics" — heat as locomotive force
- 03
Proposed Dual-Core Architecture
- · MCA: deterministic Compute-in-Memory via Spin-Orbit Torque
- · BRC: stochastic, noise-driven decision-making in micro-confined reservoirs
- · Aspirational target: fJ-scale switching energy
- 04
A Proposed Fabrication Pathway
- · DISH: rapid holographic instantiation of non-magnetic scaffolds
- · TPP: sub-100 nm precision refinement of routing tracks
- · ALD: hypothesized conformal coating of vdW ferromagnets (Fe₃GaTe₂)
- 05
The Strategic Potential
- · Energy efficiency: target reductions in energy per operation
- · Area density: theoretical gains via 3D topological volumetric scaling
- · Functional throughput: hypothesized high-throughput inference for specialized AI
- 06
Strategic Sustainability
- · Energy-proportional computing: zero leakage via non-volatile magnetic states
- · Resource efficiency: "atomic logic" replaces bulk silicon + cooling cycles
- · ESG alignment: 2030 carbon and water neutrality mandates
The carrier at the heart of the pitch. Stylized illustration — not simulation-accurate.
📊 HELIOS-3D: Research Investigation Pitch Outline
Slide 1: The Thermodynamic & Environmental Wall
- The Energy Crisis: Global AI power consumption is on a trajectory to exceed 1,000 TWh by 2026.
- The Water Crisis: Data center cooling withdrawal projected to reach billions of cubic meters by 2027.
- The Physical Limit: Traditional CMOS faces unavoidable Joule heating and embodied carbon bottlenecks.
- The Motivation: Bridging the efficiency gap between silicon infrastructure and biological benchmarks.
Slide 2: The HELIOS-3D Hypothesis
- The Concept: Exploring a Hybrid-manufactured Energy-Landscape Inference and Operation System.
- The Carrier Shift: Investigating the transition from electrical charge to topologically protected 3D spin textures (skyrmions and hopfions).
- The Energy Flip: Researching “Spin Caloritronics” to determine if waste heat can be repurposed as a locomotive force for stochastic processing.
Slide 3: Proposed Dual-Core Architecture
- Magnetic Convolutional Accelerator (MCA): Investigating deterministic Compute-in-Memory via Spin-Orbit Torque (SOT).
- Brownian Reservoir Computing (BRC): Researching stochastic, noise-driven decision-making in micro-confined reservoirs.
- Aspirational Targets: Theoretical projections target fJ-scale switching energy, representing a significant reduction over CMOS standards.
Slide 4: A Proposed Fabrication Pathway
- HELIOS-3D investigates an integrated, hybrid manufacturing flow:
- DISH: Rapid holographic instantiation of non-magnetic scaffolds.
- TPP: Sub-100nm precision refinement of routing tracks.
- ALD: Hypothesized conformal coating of van der Waals ferromagnets ().
Slide 5: The Strategic Potential
- If the HELIOS-3D hypothesis is validated, the architecture seeks to achieve significant orthogonal gains across three dimensions:
- Energy Efficiency: Target reductions in energy per operation.
- Area Density: Theoretical gains via 3D topological volumetric scaling.
- Functional Throughput: Hypothesized high-throughput inference for specialized AI tasks.
Slide 6: Strategic Sustainability (Green Spintronics)
- Energy-Proportional Computing: Achieving zero leakage current via non-volatile magnetic states.
- Resource Efficiency: Using “Atomic Logic” (nanograms of critical materials) to replace bulk silicon-intensive cooling cycles.
- ESG Alignment: Positioned to meet 2030 corporate carbon and water neutrality mandates.